Mechanics and Computation / View source

for CMOS MEMS for Mechanical Sensing and Neuroscience

<b>CMOS MEMS for Mechanical Sensing and Neuroscience</b><br>
Thursday March 11, 4:15pm<br>
Bldg 60 Room 120 <br>
<i>Oliver Paul, Department of Microsystems Engineering (IMTEK), University of Freiburg, Germany</i><br>

Piezoresistive mechanical sensing is currently experiencing a renaissance stimulated by such novel developments as piezoresistive field effect transistors with multiple source-drain contacts and sensor elements for the measurement of out-of-plane components of the stress tensor. The first part of the talk will present these sensors elements from their foundations to the realization of smart sensor systems for applications including smart orthodontic brackets, a three-dimensional surface coordinate measurement system, and sensor chips for packaging reliability studies. 
The second part is dedicated to results of the EU-financed project NeuroProbes, where intracortical neural probes for electrical and chemical sensing and stimulation have been developed by a consortium of 15 partners. CMOS-integrated microneedle probes with up to 188 electrode sites have advanced the state of the art in spatial resolution by such probes, enabling a richer picture of intracortical communication processes to be obtained.
Finally, these two lines of research will be merged by the description of microneedle-shaped stress sensor arrays. These structures are designed to help neuroscientists to understand and minimize the mechanical probe-brain interaction during penetration and acute and chronic experiments.

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