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Electrostatic Micromotors and Micromachining Methods for their Fabrication
ELECTROSTATIC MICROMOTORS AND MICROMACHINING METHODS FOR THEIR FABRICATION Edin Sarajlic <br> CIRMM, Institute of Industrial Science (IIS),<br> The University of Tokyo, Japan This seminar focuses on the development of micromotors and micromachining methods for their fabrication. Electrostatic stepper motors with built-in mechanical leverage (shuffle and contraction beams motors), MicroElectroMechanical Digital-to-Analog Converters (MEMDAC) of displacement and 3-phase electrostatic stepper motors will be presented. High performance characteristics of these motors in terms of output force, displacement range, positioning resolution, speed and durability make them promising candidates for numerous possible applications including data storage, microassembly, microscopy, robotics and optical systems. In general, electrostatic micromotors require proper electrical insulation between mechanically interconnected structures. Two micromachining methods, vertical trench isolation and High Aspect Ratio Etching and Metallization (HAREM), will be introduced. These methods allows distinct electrical domains to be formed on both fixed and movable micromechanical parts opening a wide range of opportunities for simplified fabrication and performance improvement of micromotors, and MEMS in general. 1D Shuffle Motor 2D Shuffle Motor Vertical Trench Isolation BIOGRAPHY Edin Sarajlic received in 2001 the M.Sc. degree (Cum Laude) in mechanical engineering from The University of Twente, The Netherlands. In 2005 he completed the Ph.D. course in electrical engineering in Transducers Science and Technology Group conducted by Prof. Dr. Miko Elwenspoek at MESA+ Research Institute, The University of Twente. He is currently a Postdoctoral Researcher in the MEMS Lab of Prof. Hiroyuki Fujita at Institute of Industrial Science, The University of Tokyo, Japan. His research interest focuses on the development of microactuators and micromachining methods for their fabrication.
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