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Mechanics of Surface Effects in Nanoscale Device-Making and Manufacturing
=K. Jimmy Hsia= Department of Mechanical Science and Engineering <br>University of Illinois at Urbana-Champaign<br> Urbana, IL 61801, USA <br>kjhsia@illinois.edu<br> ===Mechanics of Surface Effects in Nanoscale Device-Making and Manufacturing=== Nanoscale science and technology has been an important frontier in research and development in the past decade. Miniaturization is the major driving force behind these research activities. As the characteristic dimensions of devices and MEMS/NEMS components become smaller, however, the surface to volume ratio of these components increases significantly. Consequently, many surface phenomena, such as capillary interactions and surface adhesion, become increasingly important. Many scientific issues of these phenomena can be best understood using a mechanics approach. In this talk, I will use two particular case studies to demonstrate that mechanics can indeed be a powerful tool to help understand these phenomena and provide guidance for nanomanufacturing and device-making. One case study considers the self-assembling process of a 3-D photovoltaic device made of thin silicon foil. The other studies the collapse of PDMS contact printing stamps. In both cases, models were developed to help understand the mechanisms controlling the behavior of these processes. Critical parameters emerge naturally from these analyses which can be used to guide the device formation and manufacturing of nanoscale components. About the Speaker: Dr. K. Jimmy Hsia is Professor of Mechanical Science and Engineering at the University of Illinois at Urbana-Champaign where he has been on the engineering faculty for the past 16 years. He received his B.S. in Engineering Mechanics from Tsinghua University, Beijing, China, and his Ph.D. in Mechanical Engineering from MIT. He has been a Visiting Scientist at the Max-Planck Institute for Metals Research in Stuttgart, Germany, a Visiting Professor at Nagoya University in Japan, and a Visiting Professor at Shenyang National Laboratory for Materials Research in China. His research interests include deformation and failure mechanisms of materials at ambient and elevated temperatures, nano/micromechanics of materials, and nanoscale phenomena in biomaterials. He has served as Guest Editor/Co-Editor for several special issues of Materials Science and Engineering. He is recipient of an NSF Research Initiation Award, a Max-Planck Society Scholarship, and a Japan Society for Promotion of Science Fellowship. From 2005-2007, Jimmy Hsia served as the Founding Director of Nano and Bio Mechanics & Materials Program in the Directorate for Engineering at the National Science Foundation (NSF). At NSF, he was actively involved in establishing the initiative of “Cellular and Biomolecular Engineering” for the new Office of Emerging Frontiers in Research and Innovation. He also participated in the Interagency Modeling and Analysis Group (IMAG) involving NSF, NIH, NASA, and DoE programs, and other multi-agency activities. Jimmy Hsia returned to teaching at the University of Illinois in Fall of 2007. He has been named an Associate of Center for Advanced Study at UIUC since August of 2008.
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